ETEC® P4K
ETEC®
P4K
For 3D printing ultra-high resolution parts in volume
Designed for a 24/7 production environment, the P4K 3D printer can run lights out with little to no user intervention required. Easily print parts at volume with the quality, surface finish and tolerances needed for end-use applications.
P4K is the highest resolution advanced DLP printer with the largest build envelope and deploys artificial intelligence in pixel modulation to deliver the highest accuracy parts.
Custom-Tailored
Production 3D Printing
P4K is the opposite of one-size-fits-all 3D printing solutions. From four distinctive models, you can choose your optical configuration based on part size, feature-size requirements and throughput and tailor a solution that best suits your manufacturing needs.
With resolutions of between 23µm-90µm on the X and Y axes, the P4K can easily produce detailed parts in a range of sizes. From just 2 mm, smaller than two grains of sand, to 230 mm – about the size of 3 credit cards stacked end to end.
Features
Digital Light Processing Technology (DLP)
DLP-based 3D printer utilizing a 4K projector
Industrial DLP Chip & Custom Designed Optical Train
P4K is equipped with an industrial DLP chip & a custom optical train for high contrast and minimal distortion in the projected picture.
Multiple High-resolution Options
Resolutions of between 23µm-90µm on the X and Y axes
4 Build Envelopes
Four differently-sized build plates allow for four different native pixel sizes (XY resolution): 35,62,75, and 90 um.
24/7 Production
Enter the era of mass production (AM 2.0) with P4K, designed to fabricate end-use parts around the clock.
Remotely-managed Use
Powered by ETEC’s software, the P4K is perfect for remotely-managed enterprise use.
User-friendly Envision One RP software
Envision One RP software automates all parts of the printing process.
Benefits of the ETEC P4K
Accuracy down to the micron level
The P4K comes in four distinct models with four different native pixel sizes (XY resolution): 35, 62, 75, and 90 microns. Each model is equipped with a 4K projector. Moreover, the use of industrial DLP chips, as opposed to cheaper consumer-grade chips, and a custom-designed optical train deliver high contrast and minimal distortion in the projected picture.
Fully automated manufacturing
The P4K allows you to take control of the manufacturing workflow with:
- automated job queuing managed by an onboard processor and hard drive
- automated job completion alerts to help minimize printer downtime
Powered by ETEC’s software, the P4K is perfect for remotely-managed enterprise use.
You can send jobs to multiple machines around the globe through a dashboard and easily monitor the printing progress, job status, layer count and more.
To further limit downtime, the build plate can be quickly swapped, allowing a new job to be started minutes after a print is completed.
Intuitive software
P4K has a user-friendly software, Envision One RP, that automates all parts of the printing process, including support generation and part orientation. You can take advantage of the most up-to-date tools and print processes thanks to the P4K’s over-the-air updates for both software and firmware.
Easy material changes
- Less than two minutes of material changes allow users to produce a wide variety of parts with properties tailored to different applications.
- Excess material can be stored for months, helping you to achieve further cost efficiencies.
Materials
RC Series
Material: Hard plastics
The RC-Series are ceramic-filled, high-temperature resins for tough and stiff parts at extremely high resolutions.
Full Description
ETEC®’s RC materials contain ceramic particles allowing for tough and stiff parts with high-temperature resistance. The wide variety of finishing methods for these materials – including painting and plating – make them popular for animation applications.
Specs
- Tensile Strength: 39 MPa
- Elongation at Break: 2.9 %
- Heat Deflection Temperature at 0.455 MPa: 93° C
Application
- Custom connectors
- High-detail mold masters
- Animation applications for the entertainment industry
Technology/Process
- DLP (Digital Light Processing)
E-Toughflex
Material: Hard plastics
E-Toughflex features very high flexural modulus and strength, as well as hydrophobic properties.
Full Description
E-ToughFlex is ideal for producing tough end-use parts with a beautiful surface finish similar to ceramic and good abrasion resistance.
Specs
- Tensile Strength: 67.5 MPa
- Tensile Modulus:1340 MPa
- Elongation at Break: 16%
- Impact Strength (Notched): 20 J/m
- Heat Deflection Temperature: at 1.82 MPa 58° C
Application
- Consumer Goods
- Education
- Medical Devices
- Manufacturing
Technology/Process
- DLP (Digital Light Processing)
HTM140
Material: High-temperature plastics
ETEC®’s HTM140 High-Temperature Mold material has a heat deflection temperature of 140°C straight out of the machine.
Full Description
High-definition parts printed in HTM140 can be directly vulcanized in rubber, eliminating the need for a metal master.
Specs
- Tensile Strength: 56 MPa
- Flexural Modulus: 3350 MPa
- Elongation at Failure: 3.5 %
- Heat Deflection Temperature at 0.455 MPa: 140°C
- Colour: Green
Application
- Applications that require thermal resistance such as items to be metalized.
- High-temperature oil & gas applications
- Tools for small-run injection molding
Technology/Process
- DLP (Digital Light Processing)
Easy Cast 2.0
3D Printing resin for castable models
Easy Cast 2.0 is a photopolymer with the highest wax content available in 3D printing today. It is a material for the high-speed printing of castable models.
Full Description
Easy Cast 2.0 C is a material developed for printing exclusively on EnvisionTEC’s patented cDLM printers. Because the continuous digital light processing technology has almost zero separation forces during printing, it allows for 90% liquid wax content in the formulation. Consequently, patterns printed in Easy Cast 2.0 C feature burnout similar to injection wax.
Specs
- Viscosity: 200 cP @ 30°C
- Density: 1.08 g/cm3
- Temperature @ 5% Weight Loss: 263°C
- Ash Content (after 900°C): 0
Application
- Jewelry
Technology/Process
- cDLM – Continuous Digital Light Processing
Technical Specifications
Build Envelope (L x W x H) |
Build Envelope (L x W x H)
|
Native XY Resolution |
Native XY Resolution
|
Z Resolution |
Z Resolution25 - 150 μm |
Footprint (L x W x H) |
Footprint (L x W x H)
|
Electrical Requirements |
Electrical Requirements
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