Henkel® LOCTITE®3D IND147™ 3D Printer Settings
LOCTITE - IND147 HDT230 High Heat Photoplastic Black 3D Printer Settings for EnvisionOne.
Read MoreHigh-temperature resistant 3D printing material for end-use parts and tooling, including molds
Henkel® LOCTITE®
Due to its high stiffness and high-temperature resistance, which withstands temperatures up to 230°C, Henkel LOCTITE 3D IND147 is a rigid 3D printing resin designed for tooling and molding applications.
Loctite 3D IND147 is a high-performance additive manufacturing material developed for digital light processing 3D printing technology (DLP). Its strong mechanical properties deliver high stiffness and toughness while withstanding temperatures up to 230°C. With a smooth surface finish, it can tackle applications like polyurethane and silicone molding. In post-processing, the printed components can be easily painted, sanded, or machined for further finishing.
Material: Henkel® LOCTITE® 3D IND147™ HDT230
This serrated end fitting was used for a hose connection in an automotive painting assembly line.
Material: Henkel® LOCTITE® 3D IND147™ HDT230
The water pump cap was designed for a locking mechanism in a water pump for the agriculture industry.
Material: Henkel® LOCTITE® 3D IND147™ HDT230
This injection-mold core is inserted into a Multi Unit Die (MUD) for a low-volume injection molding run of ABS plastic.
TENSILE STRENGTH
75 MPa
TENSILE MODULUS
3192 MPa
ELONGATION AT FAILURE
3%
HEAT DEFLECTION TEMPERATURE
at 0.455 MPa 238ºC
Heat Deflection | |
Toughness | |
Surface Finish | |
Stiffness |
LOCTITE - IND147 HDT230 High Heat Photoplastic Black 3D Printer Settings for EnvisionOne.
Read MoreHenkel®LOCTITE - IND147 HDT230 High Heat Photoplastic Black Technical Brochure.
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Tensile Stress at Break |
Tensile Stress at BreakASTM D638, 30.7 ± 1.6 MPa |
Young's Modulus |
Young's ModulusASTM D 638, 1150 ± 137 |
Elongation at Failure |
Elongation at FailureASTM D638, 5.9 ± 1.7 % |
Flexural Stress at Yield |
Flexural Stress at YieldASTM D790, 68 ± 3 MPa |
Flexural Modulus |
Flexural ModulusASTM D790, 2053 ± 189 MPa |
Viscosity @ 25°C (77°F) |
Viscosity @ 25°C (77°F)ASTM D7867, 2105 ± 200 cP |
Liquid Density |
Liquid DensityASTM D1475, 1.15 g/mL |
*Material properties may vary depending on the DLP printer and post-curing unit.