Copper (DM Production System)

Copper-production system 3d printed part

DESKTOP METAL®

Copper

Electrically and thermally conductive components at scale

Copper is known for its electrical and thermal conductivity and ductility, which make it ideal for electrical equipment, plumbing, and heat transfer applications. With Desktop Metal's Production System, you can 3D print electrically and thermally conductive components at scale, at a fraction of the cost of conventional manufacturing methods.

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Brochure Request Demo get a free sample have parts made

Copper. For heat or electricity transfer applications

Pure copper has > 99.95% purity and it enables excellent thermal and electrical conductivity. You can print copper parts on the Production System™ with significant geometric complexity in a single step instead of brazing multiple conventionally produced copper components together. This way, manufacturers can eliminate a time-intensive and expensive process that is prone to error and waste. With the geometric freedom enabled by binder jetting, engineers can also explore new, high-performance designs to improve heat transfer. Lattice structures and conformal cooling channels are not possible with conventional manufacturing methods.

 

 

Copper_heat-exchanger

Applications

Proto3000-electric-icon

Consumer & Industrial Electronics

Thermal Homogeneity icon

Heat Exchangers

Proto3000_Geometry Preservation icon

Coldplates & Chillers

High_Accuracy icon proto3000

Antennas

Production Control icon

Inductors

Copper-production system thumbnail

Liquid Cooling Plate

Material: Pure Copper, > 99.95% purity

Liquid cooling plates are used to regulate temperature on high-performance microprocessors. Coolant flows through the fins, which provide a large surface area to transfer heat from the passing fluid to the heat sink in order to cool the chip that is attached to the outer body.

Full Description

These cooling geometries typically require capital-intensive, long lead time, and skilled labour-intensive production processes, such as skiving and machining, given the challenges associated with achieving precision and repeatability in such a small form factor. In addition, these commonly used conventional manufacturing processes are subtractive and produce excess scrap material, greatly increasing the associated part costs.

Whereas conventional production methods for this liquid cooling plate required machining and assembling multiple separate components due to restrictions on tool access, binder jetting on the Production System™ can produce the part as a single component, reducing manufacturing and operational complexity, part cost, and lead time. The Production System unlocks the capacity to print hundreds of cooling plates per day, enabling cost-effective volume production. Copper is the ideal material for heat exchangers due to its excellent conductivity, maximizing heat dissipation from the electronic chip to the cooling fluid.

Technology/Process
  • Single Pass Jetting™ (SPJ) Technology

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No more waiting for machined or cast parts. Iterate faster by printing highly complex metal parts without leaving the office.

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Material Properties

ULTIMATE TENSILE STRENGTH¹
As sintered, ASTM E8
Proto3000_Icons_Tensile Strength

174 ± 5 MPa

¹YS & UTS properties noted represent mean values across XY orientation

YIELD STRENGTH¹
As sintered, ASTM E8
Proto3000_Icons_Tensile Modulus

37 ± 3 MPa

¹*YS & UTS properties noted represent mean values across XY orientation

ELONGATION AT BREAK
As sintered, ASTM E8Proto3000_Icons_Elongation at Break

28 ± 5%

DENSITY
Tempered
Proto3000_Icon_Density

8.65 ± 0.005 g/cm³

Performance Scale

Thermal & Electrical Conductivity
Strength
Heat Dissipation

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Technical Specifications

Ultimate Tensile Strength*
Ultimate Tensile Strength*
As sintered, ASTM E8: 174 ± 5 MPa

*YS & UTS properties noted represent mean values across XY orientation
Yield Strength*
Yield Strength*
As sintered, ASTM E8: 37 ± 3 MPa

*YS & UTS properties noted represent mean values across XY orientation
Elongation at Break
Elongation at Break
As sintered, ASTM E8: 28 ± 5%
Coefficient of Thermal Expansion (ºC )
Coefficient of Thermal Expansion (ºC )
  • ASTM E223 20 – 38ºC: As sintered, 17.36

  • ASTM E223 20 – 66ºC: As sintered, 17.35

  • ASTM E223 20 – 93ºC: As sintered, 17.27

  • ASTM E223 20 – 121ºC: As sintered, 17.06

  • ASTM E223 20 – 149ºC: As sintered, 17.10
Electrical Conductivity* (%IACS)
Electrical Conductivity* (%IACS)
ASTM E1004: 90±1

*Cubes with side lengths of 14 mm were used for electrical conductivity measurements
Thermal Conductivity (W/m-K)
Thermal Conductivity (W/m-K)
ASTM E1461-13: 349 ± 7
Density
Density
ASTM B311: 8.65 ± 0.005 g/cc
Surface Finish*
Surface Finish*
ISO 4287: 3 - 12 µm Ra

*Surface roughness measured after sintering; the low end is top surface and the high end is z-direction.

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