ETEC® Envision One™

ETEC® DESKTOP Family
Envision One™
The number one in its class.
The ETEC EnvisionOne™ is a desktop continuous DLP 3D printer for the rapid production of strong, fully-isotropic end-use parts.
Continuous 3D Printing
Powered by Light.
The ETEC EnvisionOne is a powerful desktop 3D printer that features patented cDLM (continuous digital light manufacturing) technology which enables breakneck print speeds with little to no delay between layers. With a wide range of compatible materials, simple workflow software, and a precision light engineer, the EnvisionOne delivers exceptional speed, print resolution, surface finish, and part mechanical properties.
Key Features
Benefits
Faster and reliable parts.
The cDLM process allows for continuous printing without the need to peel each layer off the film after it is polymerized.
A ‘dead zone’ is formed by flowing a thin layer of oxygen above the film of the printing bed. Within this ‘dead zone’, the polymerization process is inhibited ensuring the layer being printed adheres to the layer above and not the printing bed film. This ‘dead zone’ is what enables continuous printing, where the build plate can continually move in the Z-axis, leading to faster, more reliable prints.
Unbeatable part performance
Parts that are manufactured via cDLM are made up of entangled long-chain polymers, thus resulting in fully isotropic parts, something that cannot be achieved via the FDM process. To create the long-chain polymers, printers must process highly viscous resins which require great power to polymerize. These resins cannot be jetted (PolyJet) and would take too long to process with vector-based polymerization methods such as the SLA.
High-resolution printing
The EnvisionOne cDLM is known to produce high-resolution parts. It uses DLP chips instead of cheaper consumable grade chips and has a custom-designed optical train. These enable high contrast and minimal distortion for the projected picture which results in accuracy down to the micro-level. The cDLM domeless printing process eliminates the “dome” effect to deliver incredible Z accuracy.
Envision One RP software streamlines the entire fabrication process
Envision One RP software automates support generation and part orientation, while an integrated file repair tool patches meshes and readies the parts for print. Cloud software allows users to remotely manage the system, send jobs to multiple printers and monitor job progress, while over-the-air software and firmware updates ensure that users have access to the most up-to-date tools and processes.
Featured Materials

LOCTITE® 3955 HDT280 FST
Material: High-temperature plastics
LOCTITE® 3955™ is a halogen-free, high-performance, high modulus material with excellent flexural and tensile physical properties.
Full Description
The material passes UL94 flammability V-0 and FST (AirBus AITM2-0002, AITM2-0007, AITM3-0005) and its high HDT allows it to withstand harsh environments with negligible deformation. Parts printed with 3955 show-case an outstanding surface finish making it ideal for interior components for the aerospace and rail industries. LOCTITE® 3955™ has been tested in QUV exterior weathering conditions (ASTM G-154 at Cycle 1) for 1600 hours with less than a 15% change in Flexural properties.
Specs
- Tensile Strength: 66 MPa
- Tensile Modulus: 3556 MPa
- Elongation at Failure: 2.10 %
- Heat Deflection Temperature: at 0.455 MPa 300-plus°C
Application
- Aerospace – LOCTITE® 3955 HDT280 FST is the first 3D photopolymer that passes vertical burn and aerospace standards
- HVAC Components for Aircraft
- Clips and Plugs for Control Systems/Cabinets
- Connectors, Electronic Housings
- Automotive
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® E-3843
Material: Hard plastics
This semi-flexible ABS-like material is a high-performance, high-modulus material with good impact resistance and thermal stability.
Full Description
Loctite® E-3843 is an ETEC-validated material from Henkel, with excellent flexural and tensile properties and a relatively high degree of elongation. Characteristics:
- Tough resin with high impact resistance
- High print resolution
- Excellent surface finish
- High heat deflection temp
Available in:
- Black
- Grey
Specs
- Tensile Strength:60 MPa
- Tensile Modulus: 1890 MPA
- Elongation at Break: 47%
- Impact Strength: (Notched) 53.8 J/m
- Heat Deflection Temperature at 0.455 MPa (C): 56°C
Application
- End-use parts production
- Functional prototyping
- Engineering applications
Technology/Process
- DLP (Digital Light Processing)

E-Toughflex
Material: Hard plastics
E-Toughflex features very high flexural modulus and strength, as well as hydrophobic properties.
Full Description
E-ToughFlex is ideal for producing tough end-use parts with a beautiful surface finish similar to ceramic and good abrasion resistance.
Specs
- Tensile Strength: 67.5 MPa
- Tensile Modulus:1340 MPa
- Elongation at Break: 16%
- Impact Strength (Notched): 20 J/m
- Heat Deflection Temperature: at 1.82 MPa 58° C
Application
- Consumer Goods
- Education
- Medical Devices
- Manufacturing
Technology/Process
- DLP (Digital Light Processing)

E-Rigid Form
Material: Hard plastics
This polyurethane-like resin 3D prints strong, hard, and stiff end-use parts. It has high tensile strength, delivers good heat deflection, and is water-resistant.
Full Description
E-RigidForm is a versatile and tough material with characteristics such as
- High tensile strength
- High Stiffness
Specs
- Tensile Strength: 68-73 MPa
- Tensile Modulus: 2950-3250 MPa
- Elongation at Break: 6%
- Impact Strength (Notched): 30 J/m
- Heat Deflection Temperature at 1.181 MPa: 62.5°C
Application
- Industrial & Consumer Applications
- Great for prototyping and end-use parts
Technology/Process
- DLP (Digital Light Processing)

HTM140
Material: High-temperature plastics
ETEC®’s HTM140 High-Temperature Mold material has a heat deflection temperature of 140°C straight out of the machine.
Full Description
High-definition parts printed in HTM140 can be directly vulcanized in rubber, eliminating the need for a metal master.
Specs
- Tensile Strength: 56 MPa
- Flexural Modulus: 3350 MPa
- Elongation at Failure: 3.5 %
- Heat Deflection Temperature at 0.455 MPa: 140°C
- Colour: Green
Application
- Applications that require thermal resistance such as items to be metalized.
- High-temperature oil & gas applications
- Tools for small-run injection molding
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® IND402
Elastomer
This material maintains excellent tensile strength with high energy return and does not require secondary thermal post-processing.
Full Description
E-IND402 is a single component elastomer material with excellent green strength and does not require thermal post-processing.
Key Features:
- Elastomeric behaviour
- High resilience
- Good rebound performance
Specs
- Hardness: Shore A 76
- Tear Strength: 28 kN/m
- Elongation at Break: 230%
- Tensile Stress at Break: 5.5 MPa
Application
Ideal for elastomer applications that require lattice structures, such as vibration isolators.
- Aerospace
- Automotive
- Consumer Goods
- Manufacturing
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® IND 405
Material: Hard plastics
High-strength engineering plastic, good for end-use parts and tooling applications.
Full Description
A high-strength engineering plastic with good impact resistance and excellent surface finish. Ideal for a wide variety of tools on the production floor and end-use functional high production parts in various industries.
- IND 405 is available in black or clear.
Specs
- Tensile Strength: 52 MPa
- Tensile Modulus: 1300 MPa
- Elongation at Break: 127%
- Impact Strength (Notched): 72 J/m
- Heat Deflection Temperature: at 0.455 MPa 53° C
Application
- Enclosures & housings
- Light pipe prototypes
- Bottle prototypes
- Tooling for high-impact, high-pressure processes
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® IND406
Material: High-temperature plastics
LOCTITE® IND406™ is a high-strength, high elongation engineering plastic with good impact and a high deflection temperature of 100°C
Full Description
The material offers all-around strength, good impact resistance, and high elongation. IND406 is a great alternative for traditional injection molded plastics such as ABS and PP.
Key Features:
- High heat deflection temperature
- High elongation while maintaining high heat deflection
- Tough and durable
- The surface finish needed for end use parts
- Biocompatibility: ISO 10993 -5/-23 passed
Specs
- Tensile Strength: 55 MPa
- Tensile Modulus: 1610 MPa
- Elongation at Failure: 25 %
- Heat Deflection Temperature at 0.455 MPa: 107°C
Application
- Production of end-use parts across all industries
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® MED 413
Material: Hard plastics
MED 413 is a medical-grade, high-modulus photopolymer. It meets the ISO 10993-5 & -10 standards for biocompatibility.
Full Description
Key Features:
- Outstanding surface finish
- Excellent flexural and tensile properties
- Toughness and stiffness
Specs
- Tensile Strength: 40 MPa
- Tensile Modulus: 1600 MPa
- Elongation at Break: 50%
- Impact Strength (Notched): 59 J/m
- Heat Deflection Temperature: at 0.455: MPa 70°C
Application
- Medical devices
- for end-use parts
Technology/Process
- DLP (Digital Light Processing)

LOCTITE® IND147 HDT230 Tough
Material: High-temperature plastics
Loctite® IND147 is a high-temperature resistant photopolymer and can be printed with very high-resolution features (50 um).
Full Description
This material delivers high stiffness and toughness while withstanding temperatures up to 230°C. The 3D printed parts with Loctite IND147 can be easily painted, sanded or machined for further finishing.
Specs
- Tensile Strength: 75 MPa
- Tensile Modulus: 3192 MPa
- Elongation at Failure: 3%
- Heat Deflection Temperature at 0.455: MPa 238 C
Application
- Tooling (molds)
- High-temperature use parts
Technology/Process
- DLP (Digital Light Processing)
Technical Specifications
Build Envelope |
Build Envelope180 x 101 x 175 mm (7.09 x 3.98 x 6.9 in.)XL Version also available with 330 mm Z-Height |
Build Speed |
Build SpeedUp to 45 mm/hour, material dependent |
Native XY Resolution |
Native XY Resolution93 µm |
XY Resolution with Contour Gray Scaling |
XY Resolution with Contour Gray Scaling60 µm |
Dynamic Z Resolution |
Dynamic Z Resolution50 µm to 150 µm (material dependant) |
LED Light Source |
LED Light Source385nm wavelength |
Footprint |
Footprint15.4 x 16.93 x 25.02 in. (39.1 x 43 x 63.6 cm) |
Electrical requirements |
Electrical requirements110/220 VAC 50/60 HZ 5A |