ETEC® Envision One™

ETEC® DESKTOP Family

Envision One™

The number one in its class.

The ETEC EnvisionOne™ is a desktop continuous DLP 3D printer for the rapid production of strong, fully-isotropic end-use parts.

Continuous 3D Printing
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The ETEC EnvisionOne is a powerful desktop 3D printer that features patented cDLM (continuous digital light manufacturing) technology which enables breakneck print speeds with little to no delay between layers. With a wide range of compatible materials, simple workflow software, and a precision light engineer, the EnvisionOne delivers exceptional speed, print resolution, surface finish, and part mechanical properties.

 

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Envision-One-end-to-end solution

Key Features

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cDLM Technology

The continuous digital light manufacturing technology enables high-volume and scalable part production.

Proto3000_Icon_Long Chain Chemistry

Long-chain Polymer Chemistry

The chemistry of polymers used with Envision One produces parts with exceptional part strength & quality.

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Industrial DLP Chips & Optical Train

EnvisionOne has industrial DLP chips integrated and a custom-designed optical train to enable high contrast and minimal distortion for the projected picture.

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Fast Printing

30% faster than competing systems and 10x faster than desktop SLA.

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Patented Material Tray

Ensures that the 3D printing process happens on a flat surface.

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EnvisionONE RP Intuitive Software

Automated support generation, optimized part orientation and print profiles for each material available.

Additive Manufacturing with Light

Discover the speed, throughput, and material capabilities of the
Digital Light Processing (DLP) 3D printing process

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Benefits

Faster and reliable parts.

The cDLM process allows for continuous printing without the need to peel each layer off the film after it is polymerized.
A ‘dead zone’ is formed by flowing a thin layer of oxygen above the film of the printing bed. Within this ‘dead zone’, the polymerization process is inhibited ensuring the layer being printed adheres to the layer above and not the printing bed film. This ‘dead zone’ is what enables continuous printing, where the build plate can continually move in the Z-axis, leading to faster, more reliable prints.

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Unbeatable part performance

Parts that are manufactured via cDLM are made up of entangled long-chain polymers, thus resulting in fully isotropic parts, something that cannot be achieved via the FDM process. To create the long-chain polymers, printers must process highly viscous resins which require great power to polymerize. These resins cannot be jetted (PolyJet) and would take too long to process with vector-based polymerization methods such as the SLA.

 

 

 

 

 

Isotropic Properties etec resin

High-resolution printing

The EnvisionOne cDLM is known to produce high-resolution parts. It uses DLP chips instead of cheaper consumable grade chips and has a custom-designed optical train. These enable high contrast and minimal distortion for the projected picture which results in accuracy down to the micro-level. The cDLM domeless printing process eliminates the “dome” effect to deliver incredible Z accuracy.

ETEC_EnvisionOne_High Resolution printing

Envision One RP  software  streamlines the entire fabrication process

 

Envision One RP software automates support generation and part orientation, while an integrated file repair tool patches meshes and readies the parts for print. Cloud software allows users to remotely manage the system, send jobs to multiple printers and monitor job progress, while over-the-air software and firmware updates ensure that users have access to the most up-to-date tools and processes.

 

ETEC RP Software

Engineer the Concepts of the Future Now 

Get a free demo and speak to an expert about how generative design can reinvent your design process

Featured Materials

Loctite 3955 HDT280 FST

LOCTITE® 3955 HDT280 FST

Material: High-temperature plastics

LOCTITE® 3955™ is a halogen-free, high-performance, high modulus material with excellent flexural and tensile physical properties.

Full Description

The material passes UL94 flammability V-0 and FST (AirBus AITM2-0002, AITM2-0007, AITM3-0005) and its high HDT allows it to withstand harsh environments with negligible deformation. Parts printed with 3955 show-case an outstanding surface finish making it ideal for interior components for the aerospace and rail industries. LOCTITE® 3955™ has been tested in QUV exterior weathering conditions (ASTM G-154 at Cycle 1) for 1600 hours with less than a 15% change in Flexural properties.

Specs
  • Tensile Strength: 66 MPa
  • Tensile Modulus: 3556 MPa
  • Elongation at Failure: 2.10 %
  • Heat Deflection Temperature: at 0.455 MPa 300-plus°C
Application
  • Aerospace – LOCTITE® 3955 HDT280 FST is the first 3D photopolymer that passes vertical burn and aerospace standards
  • HVAC Components for Aircraft
  • Clips and Plugs for Control Systems/Cabinets
  • Connectors, Electronic Housings
  • Automotive
Technology/Process
  • DLP (Digital Light Processing)

electronics-LOCTITE e-3843 housing

LOCTITE® E-3843

Material: Hard plastics

This semi-flexible ABS-like material is a high-performance, high-modulus material with good impact resistance and thermal stability.

Full Description

Loctite® E-3843 is an ETEC-validated material from Henkel, with excellent flexural and tensile properties and a relatively high degree of elongation. Characteristics:

  • Tough resin with high impact resistance
  • High print resolution
  • Excellent surface finish
  • High heat deflection temp

Available in:

  • Black
  • Grey
Specs
  • Tensile Strength:60 MPa
  • Tensile Modulus: 1890 MPA
  • Elongation at Break: 47%
  • Impact Strength: (Notched) 53.8 J/m
  • Heat Deflection Temperature at 0.455 MPa (C): 56°C
Application
  • End-use parts production
  • Functional prototyping
  • Engineering applications
Technology/Process
  • DLP (Digital Light Processing)

e-toughflex impeller etec

E-Toughflex

Material: Hard plastics

E-Toughflex features very high flexural modulus and strength, as well as hydrophobic properties.

Full Description

E-ToughFlex is ideal for producing tough end-use parts with a beautiful surface finish similar to ceramic and good abrasion resistance.

Specs
  • Tensile Strength: 67.5 MPa
  • Tensile Modulus:1340 MPa
  • Elongation at Break: 16%
  • Impact Strength (Notched): 20 J/m
  • Heat Deflection Temperature: at 1.82 MPa 58° C
Application
  • Consumer Goods
  • Education
  • Medical Devices
  • Manufacturing
Technology/Process
  • DLP (Digital Light Processing)

E-rigid form flow adapter housing

E-Rigid Form

Material: Hard plastics

This polyurethane-like resin 3D prints strong, hard, and stiff end-use parts. It has high tensile strength, delivers good heat deflection, and is water-resistant.

Full Description

E-RigidForm is a versatile and tough material with characteristics such as

  • High tensile strength
  • High Stiffness
Specs
  • Tensile Strength: 68-73 MPa
  • Tensile Modulus: 2950-3250 MPa
  • Elongation at Break: 6%
  • Impact Strength (Notched): 30 J/m
  • Heat Deflection Temperature at 1.181 MPa: 62.5°C
Application
  • Industrial & Consumer Applications
  • Great for prototyping and end-use parts
Technology/Process
  • DLP (Digital Light Processing)

fan-cover htm140

HTM140

Material: High-temperature plastics

ETEC®’s HTM140 High-Temperature Mold material has a heat deflection temperature of 140°C straight out of the machine.

Full Description

High-definition parts printed in HTM140 can be directly vulcanized in rubber, eliminating the need for a metal master.

Specs
  • Tensile Strength: 56 MPa
  • Flexural Modulus: 3350 MPa
  • Elongation at Failure: 3.5 %
  • Heat Deflection Temperature at 0.455 MPa: 140°C
  • Colour: Green
Application
  • Applications that require thermal resistance such as items to be metalized.
  • High-temperature oil & gas applications
  • Tools for small-run injection molding
Technology/Process
  • DLP (Digital Light Processing)

LOCTITE IND 402-clips_Proto3000

LOCTITE® IND402

Elastomer

This material maintains excellent tensile strength with high energy return and does not require secondary thermal post-processing.

Full Description

E-IND402 is a single component elastomer material with excellent green strength and does not require thermal post-processing.

Key Features:

  • Elastomeric behaviour
  • High resilience
  • Good rebound performance
Specs
  • Hardness: Shore A 76
  • Tear Strength: 28 kN/m
  • Elongation at Break: 230%
  • Tensile Stress at Break: 5.5 MPa
Application

Ideal for elastomer applications that require lattice structures, such as vibration isolators.

  • Aerospace
  • Automotive
  • Consumer Goods
  • Manufacturing
Technology/Process
  • DLP (Digital Light Processing)

Henkel LOCTITE® 3D IND405 3D printing material

LOCTITE® IND 405

Material: Hard plastics

High-strength engineering plastic, good for end-use parts and tooling applications.

Full Description

A high-strength engineering plastic with good impact resistance and excellent surface finish. Ideal for a wide variety of tools on the production floor and end-use functional high production parts in various industries.

  • IND 405 is available in black or clear.
Specs
  • Tensile Strength: 52 MPa
  • Tensile Modulus: 1300 MPa
  • Elongation at Break: 127%
  • Impact Strength (Notched): 72 J/m
  • Heat Deflection Temperature: at 0.455 MPa 53° C
Application
  • Enclosures & housings
  • Light pipe prototypes
  • Bottle prototypes
  • Tooling for high-impact, high-pressure processes
Technology/Process
  • DLP (Digital Light Processing)

fan-piece loctite ind406

LOCTITE® IND406

Material: High-temperature plastics

LOCTITE® IND406™ is a high-strength, high elongation engineering plastic with good impact and a high deflection temperature of 100°C

Full Description

The material offers all-around strength, good impact resistance, and high elongation. IND406 is a great alternative for traditional injection molded plastics such as ABS and PP.

Key Features:

  • High heat deflection temperature
  • High elongation while maintaining high heat deflection
  • Tough and durable
  • The surface finish needed for end use parts
  • Biocompatibility: ISO 10993 -5/-23 passed
Specs
  • Tensile Strength: 55 MPa
  • Tensile Modulus: 1610 MPa
  • Elongation at Failure: 25 %
  • Heat Deflection Temperature at 0.455 MPa: 107°C
Application
  • Production of end-use parts across all industries
Technology/Process
  • DLP (Digital Light Processing)

loctite med413 printed part

LOCTITE® MED 413

Material: Hard plastics

MED 413 is a medical-grade, high-modulus photopolymer. It meets the ISO 10993-5 & -10 standards for biocompatibility.

Full Description

Key Features:

  • Outstanding surface finish
  • Excellent flexural and tensile properties
  • Toughness and stiffness
Specs
  • Tensile Strength: 40 MPa
  • Tensile Modulus: 1600 MPa
  • Elongation at Break: 50%
  • Impact Strength (Notched): 59 J/m
  • Heat Deflection Temperature: at 0.455: MPa 70°C
Application
  • Medical devices
  •  for end-use parts
Technology/Process
  • DLP (Digital Light Processing)

 


locking water-pump-cap loctite ind147

LOCTITE® IND147 HDT230 Tough

Material: High-temperature plastics

Loctite® IND147 is a high-temperature resistant photopolymer and can be printed with very high-resolution features (50 um).

Full Description

This material delivers high stiffness and toughness while withstanding temperatures up to 230°C. The 3D printed parts with Loctite IND147 can be easily painted, sanded or machined for further finishing.

Specs
  • Tensile Strength: 75 MPa
  • Tensile Modulus: 3192 MPa
  • Elongation at Failure: 3%
  • Heat Deflection Temperature at 0.455: MPa 238 C
Application
  • Tooling (molds)
  • High-temperature use parts
Technology/Process
  • DLP (Digital Light Processing)

Technical Specifications

Build Envelope
Build Envelope
180 x 101 x 175 mm (7.09 x 3.98 x 6.9 in.)

XL Version also available with 330 mm Z-Height
Build Speed
Build Speed
Up to 45 mm/hour, material dependent
Native XY Resolution
Native XY Resolution
93 µm
XY Resolution with Contour Gray Scaling
XY Resolution with Contour Gray Scaling
60 µm
Dynamic Z Resolution
Dynamic Z Resolution
50 µm to 150 µm (material dependant)
LED Light Source
LED Light Source
385nm wavelength
Footprint
Footprint
15.4 x 16.93 x 25.02 in. (39.1 x 43 x 63.6 cm)
Electrical requirements
Electrical requirements
110/220 VAC 50/60 HZ 5A