ETEC® Envision One™

ETEC® DESKTOP Family

Envision One™

The number one in its class.

The ETEC EnvisionOne™ is a desktop continuous DLP 3D printer for the rapid production of strong, fully-isotropic end-use parts.

Continuous 3D Printing
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The ETEC EnvisionOne is a powerful desktop 3D printer that features patented cDLM (continuous digital light manufacturing) technology which enables breakneck print speeds with little to no delay between layers. With a wide range of compatible materials, simple workflow software, and a precision light engineer, the EnvisionOne delivers exceptional speed, print resolution, surface finish, and part mechanical properties.

 

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Envision-One-end-to-end solution

Key Features

Production Control icon

cDLM Technology

The continuous digital light manufacturing technology enables high-volume and scalable part production.

Proto3000_Icon_Long Chain Chemistry

Long-chain Polymer Chemistry

The chemistry of polymers used with Envision One produces parts with exceptional part strength & quality.

Industrial DLP Chips & Optical Train

EnvisionOne has industrial DLP chips integrated and a custom-designed optical train to enable high contrast and minimal distortion for the projected picture.

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Fast Printing

30% faster than competing systems and 10x faster than desktop SLA.

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Patented Material Tray

Ensures that the 3D printing process happens on a flat surface.

Proto3000_Icon_Measuring on All Axes

EnvisionONE RP Intuitive Software

Automated support generation, optimized part orientation and print profiles for each material available.

Benefits

Faster and reliable parts.

The cDLM process allows for continuous printing without the need to peel each layer off the film after it is polymerized.
A ‘dead zone’ is formed by flowing a thin layer of oxygen above the film of the printing bed. Within this ‘dead zone’, the polymerization process is inhibited ensuring the layer being printed adheres to the layer above and not the printing bed film. This ‘dead zone’ is what enables continuous printing, where the build plate can continually move in the Z-axis, leading to faster, more reliable prints.

Proto3000_ETEC Domeless Effect

Unbeatable part performance

Parts that are manufactured via cDLM are made up of entangled long-chain polymers, thus resulting in fully isotropic parts, something that cannot be achieved via the FDM process. To create the long-chain polymers, printers must process highly viscous resins which require great power to polymerize. These resins cannot be jetted (PolyJet) and would take too long to process with vector-based polymerization methods such as the SLA.

 

 

 

 

 

Isotropic Properties etec resin

High-resolution printing

The EnvisionOne cDLM is known to produce high-resolution parts. It uses DLP chips instead of cheaper consumable grade chips and has a custom-designed optical train. These enable high contrast and minimal distortion for the projected picture which results in accuracy down to the micro-level. The cDLM domeless printing process eliminates the “dome” effect to deliver incredible Z accuracy.

ETEC_EnvisionOne_High Resolution printing

Envision One RP  software  streamlines the entire fabrication process

 

Envision One RP software automates support generation and part orientation, while an integrated file repair tool patches meshes and readies the parts for print. Cloud software allows users to remotely manage the system, send jobs to multiple printers and monitor job progress, while over-the-air software and firmware updates ensure that users have access to the most up-to-date tools and processes.

 

ETEC RP Software

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Featured Materials

Loctite 3955 HDT280 FST

LOCTITE® 3955 HDT280 FST

Material: LOCTITE 3955 FST HH

LOCTITE® 3955™ is a halogen-free, high-performance, high modulus material with excellent flexural and tensile physical properties.

Full Description

The material passes UL94 flammability V-0 and FST (AirBus AITM2-0002, AITM2-0007, AITM3-0005) and its high HDT allows it to withstand harsh environments with negligible deformation. Parts printed with 3955 show-case an outstanding surface finish making it ideal for interior components for the aerospace and rail industries. LOCTITE® 3955™ has been tested in QUV exterior weathering conditions (ASTM G-154 at Cycle 1) for 1600 hours with less than a 15% change in Flexural properties.

Specs
  • Tensile Strength: 66 MPa
  • Tensile Modulus: 3556 MPa
  • Elongation at Failure: 2.10 %
  • Heat Deflection Temperature: at 0.455 MPa 300-plus°C
Application
  • Aerospace – LOCTITE® 3955 HDT280 FST is the first 3D photopolymer that passes vertical burn and aerospace standards
  • HVAC Components for Aircraft
  • Clips and Plugs for Control Systems/Cabinets
  • Connectors, Electronic Housings
  • Automotive
Technology/Process
  • cDLM – Continuous Digital Light Processing

Loctite E-3843 -4-barb-manifold

LOCTITE® E-3843

Material: Semi-flexible ABS-like material

This resin is a high-performance, high-modulus material with good impact resistance and thermal stability.

Full Description

Loctite® E-3843 is an ETEC-validated material from Henkel, with excellent flexural and tensile properties and a relatively high degree of elongation. Characteristics:

  • Tough resin with high impact resistance
  • High print resolution
  • Excellent surface finish
  • High heat deflection temp

Available in:

  • Black
  • Grey
Specs
  • Tensile Strength:60 MPa
  • Tensile Modulus: 1890 MPA
  • Elongation at Break: 47%
  • Impact Strength: (Notched) 53.8 J/m
  • Heat Deflection Temperature at 0.455 MPa (C): 56°C
Application
  • End-use parts production
  • Functional prototyping
  • Engineering applications
Technology/Process
  • DLP Technology

E-Tough-Flex cdlp

E-Toughflex

Hydrophobic 3D printing resin

E-Toughflex is insoluble in water and it produces super-tough parts, with nearly 4x the impact resistance as most engineering plastics.

Full Description

E-ToughFlex has a very high flexural modulus and strength. The 3D printed parts with this material have a beautiful surface finish reminiscent of ceramic yet with good abrasion resistance.

Specs
  • Viscosity @ 30°C: 660 cP
  • Shore D: 89-90
  • Heat Deflection Temperature: 58°C at 1.82 MPa
  • Vickers Hardness:18 HV
  • Young’s Modulus: 1340 MPa
  • Young’s Modulus: 1340 MPa
  • Ultimate Strength: 67.5 MPa
  • Strain at Break: 16%
  • Ultimate Flexural Strength: 136 MPa
  • Flexural Modulus: 3660 MPa

The following properties are after immersion in water 2 days at -37°C

  • Young’s Modulus: 1330 MPa
  • Ultimate Strength: 68.9 MPa
  • Strain at Break: 14%
  • Ultimate Flexural Strength:120 MPa
  • Flexural Modulus: 3300 MPa
Application
  • Consumer Goods
  • Education
  • Medical Devices
  • Manufacturing
Technology/Process

cDLM – Continuous Digital Light Processing


E-rigid form flow adapter housing

E-Rigid Form

Material: Polyurethane-like resin

This polyurethane-like resin 3D prints strong, hard, and stiff end-use parts. It has high tensile strength, delivers good heat deflection, and is water-resistant.

Full Description

E-RigidForm is a versatile and tough material with characteristics such as

  • High tensile strength
  • High Stiffness
Specs
  • Tensile Strength: 68-73 MPa
  • Tensile Modulus: 2950-3250 MPa
  • Elongation at Break: 6%
  • Impact Strength (Notched): 30 J/m
  • Heat Deflection Temperature at 1.181 MPa: 62.5°C
Application
  • Industrial & Consumer Applications
  • Great for prototyping and end-use parts
Technology/Process
  • DLP Technology

fan-cover htm140

ETEC®HTM140

Material: High-temperature molding material

ETEC’s HTM140 High-Temperature Mold Material has a heat deflection temperature of 140°C straight out of the machine.

Full Description

High-definition parts printed in HTM140 can be directly vulcanized in rubber, eliminating the need for a metal master.

Specs
  • Tensile Strength: 56 MPa
  • Flexural Modulus: 3350 MPa
  • Elongation at Failure: 3.5 %
  • Heat Deflection Temperature at 0.455 MPa: 140°C
Application
  • Applications that require thermal resistance such as items to be metalized.
  • High-temperature oil & gas applications
  • Tools for small-run injection molding
Technology/Process
  • DLP Technology

loctite_IND402_Loctite site

LOCTITE® IND402

Elastomeric UV photocurable resin

Loctite® IND402 is an elastomeric photocurable resin with high resilience and superior tensile strength.

Full Description

E-IND402 is a single component elastomer material with excellent green strength and does not require thermal post-processing.

Specs
  • Tensile Strength: 5.6 MPa
  • Young’s Modulus: 30 MPa
  • Elongation at Break: 285%
  • Energy Return: 37%
  • Viscosity @ 25°C: 13,500 cP3
Application
  • Aerospace
  • Automotive
  • Consumer Goods
  • Manufacturing
Technology/Process
  • DLP (Digital Light Processing) and cDLM (Continuous Digital Light Processing)

Henkel LOCTITE® 3D IND405 3D printing material

LOCTITE IND 405

Material: Henkel LOCTITE® 3D IND405 Clear or Black

High-strength engineering plastic, good for end-use parts and tooling applications

Full Description

A high-strength engineering plastic with good impact resistance and excellent surface finish. Ideal for a wide variety of tools on the production floor as well as end-use functional high production parts in a variety of industries. IND 405 is available in black or clear.

Specs

Tensile Strength: 52 MPa
Tensile Modulus: 1300 MPa
Elongation at Break: 127%
Impact Strength (Notched): 72 J/m
Heat Deflection Temperature: at 0.455 MPa 53° C

Application

Enclosures & housings
Light pipe prototypes
Bottle prototypes
Tooling for high impact, high-pressure processes

Technology/Process

cDLM – Continuous Digital Light Processing


fan-piece loctite ind406

LOCTITE® IND406

Material: High-temperature engineering plastic

LOCTITE® IND406™ is a high-strength, high elongation engineering plastic with good impact and high-temperature resistance.

Full Description

The material offers all-around strength, good impact resistance, and high elongation. IND406 is a great alternative for traditional injection molded plastics such as ABS and PP.

Characteristics:

  • High heat deflection temperature
  • High elongation while maintaining high heat deflection
  • Tough and durable
  • The surface finish needed for end use parts
  • Biocompatibility: ISO 10993 -5/-23 passed
Specs
  • Tensile Strength: 55 MPa
  • Tensile Modulus: 1610 MPa
  • Elongation at Failure: 25 %
  • Heat Deflection Temperature at 0.455 MPa: 107°C
Application
  • Production of end-use parts across all industries
Technology/Process
  • DLP Technology

loctite med413 printed part

LOCTITE® MED413

Material: Tough, medical-grade photopolymer

LOCTITE® MED413 is a medical-grade, high-modulus photopolymer capable of meeting ISO 10993-5 & -10 standards for biocompatibility.

Full Description

Characteristics:

  • Outstanding surface finish
  • Excellent flexural and tensile properties
  • Toughness and stiffness
Specs
  • Tensile Strength: 40 MPa
  • Tensile Modulus: 1600 MPa
  • Elongation at Break: 50%
  • Impact Strength (Notched): 59 J/m
  • Heat Deflection Temperature: at 0.455: MPa 70°C
Application
  • Medical devices
  •  for end-use parts
Technology/Process
  • DLP Technology

locking water-pump-cap loctite ind147

LOCTITE® IND147

Material: High-temperature plastic, HDT 230

Loctite® IND147 is a high-temperature resistant photopolymer and can be printed with very high-resolution features (50 um).

Full Description

This material delivers high stiffness and toughness while withstanding temperatures up to 230°C. The 3D printed parts with Loctite IND147 can be easily painted, sanded or machined for further finishing.

Specs
  • Tensile Strength: 75 MPa
  • Tensile Modulus: 3192 MPa
  • Elongation at Failure: 3%
  • Heat Deflection Temperature at 0.455: MPa 238 C
Application
  • Tooling (molds)
  • High-temperature use parts
Technology/Process
  • Only DLP Technology

Technical Specifications

Build Envelope
Build Envelope
180 x 101 x 175 mm (7.09 x 3.98 x 6.9 in.)

XL Version also available with 330 mm Z-Height
Build Speed
Build Speed
Up to 45 mm/hour, material dependent
Native XY Resolution
Native XY Resolution
93 µm
XY Resolution with Contour Gray Scaling
XY Resolution with Contour Gray Scaling
60 µm
Dynamic Z Resolution
Dynamic Z Resolution
50 µm to 150 µm (material dependant)
LED Light Source
LED Light Source
385nm wavelength
Footprint
Footprint
15.4 x 16.93 x 25.02 in. (39.1 x 43 x 63.6 cm)
Electrical requirements
Electrical requirements
110/220 VAC 50/60 HZ 5A