ETEC® D4K
ETEC®
D4K
4K Resolution with a Compact Footprint
ETEC® D4K is the highest resolution professional-grade desktop 3D printer. In addition to rapid printing speeds, the D4K can print the details needed for the most precise industries including dental, healthcare, jewelry, and end-use manufactured goods.
Industrial Performance with Desktop Affordability
The ETEC D4K puts professional-grade and high-resolution 3D printing at your fingertips with one-third the operating cost of comparable systems. Built with a reliable 4K projector light engine and ETEC’s patented PSA assembly for low peel forces between layers, the D4K can print complex parts with intricate details that other systems simply can’t.
Features
High accuracy & resolution
Accuracy down to 25 µm with the highest resolution of any 4K desktop 3D printer on the market.
Easy to use
Desktop production of high-resolution, professional-quality parts with under two-minute materials changeover and easy job creation.
4K DLP projector
Industrial-grade UV LED projector for reliability and consistency
4K industrial DLP chip
Exceptional surface finish thanks to a 4K industrial DLP chip with patented pixel tuning
Small footprint
50 x 57 x 59 mm
(19.7 x 22.4 x 23.2 in)
Open material platform
3D print with ETEC proprietary resins or 3rd party validated materials from market leaders like Henkel and Covestro
Benefits
High accuracy and resolution for precision 3D printing
Accuracy is always critical. And D4K delivers a native resolution as low as 25µm in the X and Y axes to easily produce parts with incredibly fine features suitable for a wide range of applications such as jewelry or wearable electronics.
Affordable industrial-grade 3D printing
Designers and engineers can take full advantage of additive manufacturing as they no longer need to make compromises when it comes to print quality, speed and even space as the D4K is desktop size.
The material needed to make it happen
From castable waxes to ultra-high resolution rigid polymers, and FDA-cleared medical materials, the D4K has the wide material selection needed to get the job done. Thanks to the D4K’s industrial DLP chip and high-powered 385 nm light source, this machine is capable of efficiently printing materials from ultra-high resolution hard plastics, to FDA-cleared dental materials, to castable waxes for jewelry.
Any uncured resin can be easily stored and reused for months, thus allowing you to save costs.
Fewer photoinitiators. Clear means clear.
D4K is engineered to 3D print incredibly clear materials due to a 385-nm wavelength light source. While all UV curable resins require the addition of photoinitiators, those that are cured with 385 nm wavelength light require significantly less.
Since photoinitiators are yellow, adding more would turn parts to have a yellow tint.
Rapid prototyping that’s rapid.
With the ETEC D4K and the speed of the DLP 3D printing process, you can rapidly prototype parts in the finest details possible. If your prototypes are manufacturable, then less iteration is needed. You can avoid changes or delays in the fabrication process, delivering the products to your customer much faster.
Materials
E-Perform
Material: High-temperature plastics
E-Perform is high stiffness and high heat tolerance material, ideal for producing 3D printed injection molds.
Full Description
Printed E-Perform molds can resist wear from highly abrasive materials, such as fiber-filled plastics.
Key features:
- High heat tolerance
- High stiffness
- Fast printing, easy processing and finishing
- High Accuracy
- Excellent detail resolution
Specs
- Tensile Strength: 87 MPa
- Tensile Modulus: 9000 MPa
- Elongation at Failure: 1.4 %
- Heat Deflection Temperature: at 1.81 MPa 160°C
Application
Ideal for end-use parts that require steady performance in high pressure and harsh environments, such as parts for wind tunnel testing.
Technology/Process
- DLP (Digital Light Processing)
LOCTITE® IND406
Material: High-temperature plastics
LOCTITE® IND406™ is a high-strength, high elongation engineering plastic with good impact and a high deflection temperature of 100°C
Full Description
The material offers all-around strength, good impact resistance, and high elongation. IND406 is a great alternative for traditional injection molded plastics such as ABS and PP.
Key Features:
- High heat deflection temperature
- High elongation while maintaining high heat deflection
- Tough and durable
- The surface finish needed for end use parts
- Biocompatibility: ISO 10993 -5/-23 passed
Specs
- Tensile Strength: 55 MPa
- Tensile Modulus: 1610 MPa
- Elongation at Failure: 25 %
- Heat Deflection Temperature at 0.455 MPa: 107°C
Application
- Production of end-use parts across all industries
Technology/Process
- DLP (Digital Light Processing)
RC Series
Material: Hard plastics
The RC-Series are ceramic-filled, high-temperature resins for tough and stiff parts at extremely high resolutions.
Full Description
ETEC®’s RC materials contain ceramic particles allowing for tough and stiff parts with high-temperature resistance. The wide variety of finishing methods for these materials – including painting and plating – make them popular for animation applications.
Specs
- Tensile Strength: 39 MPa
- Elongation at Break: 2.9 %
- Heat Deflection Temperature at 0.455 MPa: 93° C
Application
- Custom connectors
- High-detail mold masters
- Animation applications for the entertainment industry
Technology/Process
- DLP (Digital Light Processing)
WIC Series
Material: Castable resin High-resolution, castable material with nano-wax for clean burnout
KEY FEATURES
- Nano-wax content for excellent surface finish
- Low expansion during burnout
Full Description
With 20% powder wax content, WIC 100 delivers fine print details and fast printing speeds, along with a standard wax burnout cycle with regular gypsum investment. During the burnout cycle, the nano-wax melts away first allowing the resin to burn off without excessive expansion.
Specs
- Tensile Strength: 14.8 MPa
- Ignition Temperature: 300°C
- Density: 1.32 g/cm^3
- Colour: Green
Technology/Process
- cDLM (Continuous Digital Light Processing)
- DLP (Digital Light Processing)
Technical Specifications
Build Envelope (L x W x H) |
Build Envelope (L x W x H)148 x 83 x 110 mm(5.8 x 3.3 x 4.3 in) |
Native XY Resolution |
Native XY Resolution50 μm |
Patented Enhanced XY Resolution |
Patented Enhanced XY Resolution25 μm |
Z Resolution |
Z Resolution25 -100 μm |
LED |
LED385 nm |
UI and Connectivity |
UI and ConnectivityTouch Screen / Ethernet, USB |
Footprint (L x W x H) |
Footprint (L x W x H)50 x 57 x 59 mm(19.7 x 22.4 x 23.2 in) |
Weight |
Weight56.02 kg (123.5 lbs) |
Electrical Requirements |
Electrical Requirements100~240V AC, 1.5A, 50Hz/60Hz |
